XC7VX550T-L2FFG1927E

发布时间:2021/3/23

XC7VX550T-L2FFG1927E产品详细规格

规格书 Virtex-7 T/XT FPGA Datasheet

7 Series FPGAs Overview

文档 Additional Wafer Fabrication 16/Dec/2013

Zynq-7000 Datasheet Update 02/Jun/2014

的LAB / CLB数 43300 

安装类型 Surface Mount 

逻辑元件/单元数 554240 

标准包装 1 

供应商设备封装 1925-FCBGA (45x45) 

RAM位总计 43499520 

工作温度 0°C ~ 100°C 

电压 - 电源 0.97 V ~ 1.03 V 

I / O针脚数 600 

封装/外壳 1924-BBGA, FCBGA 

的输入/输出数 600 

RoHS指令 Lead free / RoHS Compliant 

XC7VX550T-L2FFG1927E系列产品 

型号

厂家

产品描述

XC7VX550T-L2FFG1158E  FPGA 350 I/O 1158FCBGA 

XC7VX550T-L2FF1158E  FPGA 350 I/O 1158FCBGA 

XC7VX550T-L2FF1927E  FPGA 600 I/O 1927BGA 

XC7VX550T-1FF1158C  FPGA 350 I/O 1158FCBGA 

XC7VX550T-1FF1158I  FPGA 350 I/O 1158FCBGA 

XC7VX550T-1FF1927C  FPGA 600 I/O 1927BGA 

XC7VX550T-1FF1927I  FPGA 600 I/O 1927BGA 

XC7VX550T-1FFG1158C  FPGA 350 I/O 1158FCBGA 

XC7VX550T-1FFG1158I  FPGA 350 I/O 1158FCBGA 

XC7VX550T-1FFG1927C  FPGA 600 I/O 1927BGA 

XC7VX550T-1FFG1927I  FPGA 600 I/O 1927BGA 

XC7VX550T-2FF1158C  FPGA 350 I/O 1158FCBGA 

XC7VX550T-2FF1158I  FPGA 350 I/O 1158FCBGA 

XC7VX550T-2FF1927C  FPGA 600 I/O 1927BGA 

XC7VX550T-2FF1927I  FPGA 600 I/O 1927BGA 

XC7VX550T-2FFG1158C  FPGA 350 I/O 1158FCBGA 

XC7VX550T-2FFG1158I  FPGA 350 I/O 1158FCBGA 

XC7VX550T-2FFG1927C  FPGA 600 I/O 1927BGA 

XC7VX550T-2FFG1927I  FPGA 600 I/O 1927BGA 

XC7VX550T-3FF1158E  FPGA 350 I/O 1158FCBGA 

芯片详细信息

Manufacturer Part Number:

XC7VX550T-L2FFG1927E

Pbfree Code:

 Yes

Rohs Code:

 Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

FBGA-1927

Pin Count:

1927

Reach Compliance Code:

not_compliant

ECCN Code:

3A001.A.7.B

HTS Code:

8542.39.00.01

Manufacturer:

Xilinx

Risk Rank:

5.79

Clock Frequency-Max:

1818 MHz

Combinatorial Delay of a CLB-Max:

0.61 ns

JESD-30 Code:

S-PBGA-B1927

JESD-609 Code:

e1

Length:

45 mm

Moisture Sensitivity Level:

4

Number of CLBs:

43300

Number of Inputs:

600

Number of Logic Cells:

554240

Number of Outputs:

600

Number of Terminals:

1927

Organization:

43300 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1924,44X44,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Power Supplies:

1,1.8 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.65 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.03 V

Supply Voltage-Min:

0.97 V

Supply Voltage-Nom:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

45 mm